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Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
? BV DSS
? T J
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
V GS = 0 V, I D = –250 μ A
I D = –250 μ A, Referenced to 25 ° C
–20
–14
V
mV/ ° C
I DSS
I GSSF
I GSSR
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
V DS = –16 V,
V GS = 12 V,
V GS = –12 V,
V GS = 0 V
V DS = 0 V
V DS = 0 V
–1
100
–100
μ A
nA
nA
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
? T J
R DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
V DS = V GS , I D = –250 μ A
I D = –250 μ A, Referenced to 25 ° C
V GS = –4.5 V, I D = –4.5 A
–0.6
–1.0
3
0.039
–1.5
0.053
V
mV/ ° C
?
On–Resistance
V GS = –2.5 V, I D = –3.6 A
V GS = –4.5 V, I D = –4.5A,T J =125 ° C
0.062
0.053
0.080
0.077
I D(on)
On–State Drain Current
V GS = –4.5 V, V DS = –5 V
–20
A
g FS
Forward Transconductance
V DS = –5 V,
I D = –4.5 A
16
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = –10 V,
f = 1.0 MHz
V GS = 0 V,
890
244
123
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
V DD = –10 V,
V GS = –4.5 V,
V DS = –10 V,
V GS = –4.5 V
I D = –1 A,
R GEN = 6 ?
I D = –4.5 A,
12
9
24
13
9
2
22
18
38
23
13
ns
ns
ns
ns
nC
nC
Q gd
Gate–Drain Charge
3
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
–1.3
A
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = –1.3 A
(Note 2)
–0.7
–1.2
V
Voltage
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain
pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a.
b.
78°C/W when mounted on a 1in 2 pad of 2oz copper on FR-4 board.
156°C/W when mounted on a minimum pad.
2. Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDC640P Rev E(W)
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